2016年1月13-15日，东京国际展览中心。先进焊接材料供应商Nihon Superior公司将参加日本NEPCON展会。在众多电子组装产品中，SN100C材料获得大家一致认可。

SN100C焊料不含银元素，其共晶特性和高流动性允许更快的润湿，润湿速度高于SAC305，这在波峰焊、回流焊以及手工焊应用中大有用处。展会期间，该公司将展示最新开发的产品，为电子行业面临的挑战提供解决方案，助其改进可靠性、热稳定以及无铅芯片粘接。

SN100CVTM P506 D4是一款无铅免清洗焊膏，基本组成成份是Sn-Cu-Ni+Ge+Bi。这种新合金具有另一个功能，材料即便在热循环后也能保证焊点的热稳定。它的原理与含银合金不一样，后者是从共晶Ag3Sn的细颗粒分散体中获得动能，而SN100CV是源自焊点的锡矩阵溶质原子。SN100CV P506 D4适合在室温下长期存储，这个特性使其库存管理简单，同时满足现代回流焊接工艺的所有要求。现在，市面上可供应完全不含卤素焊膏SN100CV系列，包括SN100CV P604 D4以及低残留的SN100CV P820-5 D4。

SN100C的熔点是227℃，最初被排除于回流焊中，但锡银铜合金(如熔点为217-218℃的SAC305)，一般可以以大约245℃的最高温度进行回流。因此人们认识到也可以把 SN100C作为替代产品。其高流动性和杰出的润湿性意味着SN100C可以在比SAC合金低的液相线下成功地进行回流。Nihon Superior现在为一般回流焊提供SN100C免清洗ePaste锡膏。（SMTC@ACT编译）

Lead-free Bobbinless Flux Cored Solder Wire

Now everyone is familiar with recycling, why not go one step further and reduce the energy required to recycle? This bobbinless solder helps to reduce waste, recycling energy and recycling hassles.

Lead-free Alloy for Soldering Aluminum ALUSAC-35

Despite the cost and the performance advantages of aluminum, its commercial adoption has been slow because of the concern about the galvanic corrosion that results from differences in the electrical potential of the constituent phases. joints to aluminum made with this new alloy retain reasonable strength even after 30 days of saltwater immersion.

Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces make it possible to achieve strong bonds even on copper with high electrical and thermal conductivity at low temperatures without the need for external pressure.