参赛公司：TEKNEK
参赛类别：清洗设备
获奖名称：远见奖 - Vision Award


SMT系列接触式清洁机
The new SMT range of contact cleaners

Teknek的最新版SMT系列接触式清洁机用于焊膏印刷之前的裸板清洁。SMT清洁机是一个即时系统，有助于实现 零粉尘目标 。经 3DSPI数据证实，采用Teknek机器清洁后的电路板表面呈现无异物污染、无静电状态。因此，SMT清洁机可以有效地提高焊膏印刷时的一次合格率，在提升焊膏焊接产品产量方面，得到业界广泛认可。

SMT系列清洁机首次采用了全新的Nanocleen™20.20聚合滚轮，这种清洁辊符合ANSI/ESD s20.20 2014认证标准。经SGS测试，Teknek研发的全新款专利产品Nanocleen™已成功达标，这一标准已经被Teknek用在全线SMT产品上。

在SMT焊膏印刷工艺中，有约60%的缺陷是由焊膏焊接引起的。在焊膏印刷之前，安装一台Teknek清洁机，可有效的降低产品缺陷率。Teknek不仅能降低缺陷产品，它还可以减少模板堵塞的数量，从而提高生产率。

TEKNEK清洁机适用于各个行业的各类电路板，尺寸从50mm x 500mm直至600mm x 600mm。（SMTC@ACT）

图解：TEKNEK总经理Stephen Mitchell先生代表上台领奖留念。图片来源：SMT China

Teknek will demonstrate the latest version of the SMT range of contact cleaners to clean bare boards before solder paste printing. The SMT is a real-time system that helps reach the Zero Defects Goal .

The SMT machine has proven to provide improvements of first time pass rates at solder paste printing. Instant feedback from 3DSPI results provide the evidence. When fitted with the latest Nanocleen 20.20 polymer rollers, it complies with ESD requirements as laid out by companywide Electrostatic Discharge Control programs as defined by International Standards IEC 61340-5-1 and more recently ANSI/ESD S20.20-2014.

Teknek developed a new version of its patented Nanocleen™ and following successful test at SGS has been made standard on the Teknek SMT line. Now the board leaves the Teknek machine free from contamination and static free.

These new products are ideal for increasing yields at Solder Paste. Ii widely accepted that around 60% of all defects on an SMT line arise at solder paste. Fitting a Teknek in line cleaner before solder paste reduces defect levels. Not only does the Teknek reduce defect it reduced the number of stencil blockages and therefore increases productivity.

Suitable for all board types form 50mm x 500mm up to 600mm x 600mm these cleaners are Universal.