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ITW EAE发布 ELECTROVERT DwellFlex 4.0

2020-05-15

DwellFlex 4.0可变接触式波峰焊喷嘴是业内第一个波峰喷嘴: 当不同类型的电路板通过波峰时,可动态调整波峰宽度。正在申请专利的这个设计能确保在不改变传送带速度的情况下,针对高度混合的电路板优化焊锡接触时间。这消除了生产时间的损失并且改善焊接效果。浸润时间是实现恰当的顶部孔填充而不引起铜溶解的一个关键计算量。

DwellFlex 4.0能精确控制特定于复杂PCB的波峰接触长度。智能软件比较产品之间的制程程序。波峰接触长度、泵转速 (rpm)、强制对流风机速度和助焊系统设置均可根据需要即时调整。作为单波峰解决方案,DwellFlex 4.0消除了典型的双波峰配置之间出现的温度下降。湍流波促进热能转移到PCB中,从而在狭窄的空间中实现了良好的润湿性,并为顶部孔填充施加强大的向上力。波的层流部分提供良好的连续热传递深入至PCB。它还提供了PCB在离开波时剥离所需的波特性,这对于减少桥连缺陷至关重要。单波峰解决方案提高了喷嘴效率,促进了更好的顶部孔填充,并减少了焊接过程中助焊剂的降解。所有这些优点等于减少了缺陷并提高了生产线效率。

ELECTROVERT DwellFlex 4.0 The DwellFlex 4.0 variable contact wave solder nozzle is the first wave solder nozzle that allows the wave width to be adjusted on-the-fly as variable board types are run through the wave. The patent-pending design ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds. 

This eliminates lost production time and improves solder results.Dwell time is a critical calculation to achieve proper topside hole fill without introducing copper dissolution. 

DwellFlex 4.0 allows precise control of the wave contact length specific to the PCB complexity. The intelligent software compares the recipes between the products. The wave contact length, pump speed rpm, forced convection blower speeds, and fluxer settings are all adjusted on-the-fly as needed.As a single wave solution, 

DwellFlex 4.0 eliminates the temperature drop that occurs between a typical dual wave configuration. The turbulent wave promotes transfer of thermal energy into the PCB which promotes good wetting in tight spaces and delivers strong upward force for topside hole fill.  The laminar section of the wave provides good continuation of thermal transfer into the PCB. It also provides the wave characteristics needed for the PCB to peel away while exiting the wave, which is critical to reducing bridge defects. A single wave solution improves the nozzle efficiency, promotes better topside hole fill, and promotes the reduction of flux degradation in the soldering process. All these benefits equate to reduced defects and improved line efficiency.

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