ALPHA" CVP-390是一款无铅、无卤素免清洗焊膏，专门设计用在那些需要优异引脚测试性能、并能通过JIS铜腐蚀测试的残留物的应用当中。该产品的设计也有助于实现精细间距印刷能力，利用100μm厚的钢网将印刷间距降至180μm（环状）。其出色的印刷附着量可重复性能，为通过减少因印刷工艺波动而产生缺陷提供了价值。此外，ALPHA^" CVP-390达到IPC7095 Class III级的空洞性能。

特征和优势：

• Long Stencil Life: consistent performance for at least 8 hours of continuous printing without addition of new paste
• Long, High Tack Force Life: ensures high pick-and-place yields, good self-alignment
• Wide Reflow Profile Window: allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
• Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
• Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment

• Excellent Solder joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning
• Excellent Voiding Performance: Meets IPC7095 Class III Requirement
• Halogen Content: Zero Halogen, no halogen intentionally added
• Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
• Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA EINECS